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6D5BAE61-B40F-4E89-89FD-06C16E3984EE_edi

Electronic Packaging Services

We provide electronic packaging services. Our in-house knowhow allows extra low void assemblies. Typical porosity counts are below 1%. Our packaging services are perfect for electronic components needing good thermal management.

Facility

Material Inlet Control

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Cleaning station

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Solder Printing

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SPI

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High Speed Pick-and-Place

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General Purpose Pick-and-Place

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AOI

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Reflow Solder System

 

Cleaning

 

Electronic Testing Station 

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